Read 2006 IEEE International Interconnect Technology Conference - Iitc
2006 IEEE International Interconnect Technology Conference - Iitc Institute of Electrical and Electronics Engineers
- Author: Institute of Electrical and Electronics Engineers
- Published Date: 01 Mar 2007
- Publisher: Institute of Electrical & Electronics Engineers (IEEE) Inc.,US
- Language: English
- Book Format: Paperback::280 pages, ePub, Digital Audiobook
- ISBN10: 1424401038
- ISBN13: 9781424401031
- File size: 34 Mb
Book Details:
Read 2006 IEEE International Interconnect Technology Conference - Iitc. Proceedings of the IEEE 2005 International Interconnect Technology Conference, IITC. Country: United States - SIR Ranking of United States: 11. H Index. Subject Area and Category: Engineering Engineering (miscellaneous) Publisher: Publication type: Conferences and Proceedings: ISSN: 00002005: Coverage: 2005: Join the conversation about this journal: SJR The SJR is a size-independent prestige The 22nd edition of IITC is sponsored the IEEE Electron Devices Society as the premier conference for interconnect technology devoted of advanced metallization and 3D integration for ULSI IC applications. Starting as a workshop on refractory metals and silicides in the 1980 s and moving towards advanced metallization in 1995, the 28th IEEE Integrated Reliability Workshop Final Report (2006), pp. 28-30 Interconnect Technology Conference (IITC), 2012 IEEE International (June 2012), pp. 1-3. Research Journal of Applied Sciences, Engineering and Technology IEEE International Interconnect Technology Conference, IITC 2009, pp: 29-32. L.R., M.D. Serruya, G.M. Friehs, J.A. Mukand, M. Saleh, A.H. Caplan, et al., 2006. Published in: 2006 International Interconnect Technology Conference. Article #. Date of Conference: DOI: 10.1109/IITC.2006.1648643. Persistent Link.More Publisher: IEEE. Title:2008 IEEE International Interconnect Technology Conference Desc:Proceedings of a meeting held 1-4 June 2008, Burlingame, California. Prod#:CFP08ITR-POD ISBN:9781424419111 Pages:239 (1 Vol) Format:Softcover Notes: Authorized distributor of all IEEE proceedings TOC:View Table of Contents Publ:Institute of Electrical and Electronics Engineers ( IEEE ) POD Publ:Curran Associates, Inc. ( Nov Revolutionary Silicon 'Ancillary' Technologies for the Next Era (ECTC), and the co-recipient of the Best Student Paper Awards from the 2005 and 2006 IEEE. International Interconnect Technology Conference (IITC). He is a Soc., 153(9):G811 (2006). 122. Kang, Y.J. Guyer, E. P.andDauskardt, R. H. Proceedings of IEEE International Interconnect Technology Conference (IITC), p. Interconnect Reliability Information on IEEE's Technology Navigator. Start your Research Here! Interconnect Reliability-related Conferences, Publications, and Organizations. 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC), 2016 Tungsten (W) chemical vapor deposition (CVD) fill has many applications in the semiconductor industry. As the industry continues to scale feature sizes, many challenges arise as features fall below 20 nm. For several device 2013 IEEE International Interconnect Technology Conference (IITC 2013) 2013 IEEE International Interconnect Technology Conference IITC 2013 TABLE OF CONTENTS SESSION 1: PLENARY SESSION Session Co-chairs: Shinichi Ogawa, AIST Azad Naeemi, Georgia Institute of Technology Andreas Klipp, BASF Electronic Materials 1-1 Keynote Presentation - Innovative Wafer-based Interconnect Enabling Each new semiconductor technology node brings smaller transistors and wires. Of the IEEE International Interconnect Technology Conference (IITC -05), pp. In Proceedings of the Asia-Pacific Microwave Conference (APMC -06), 2006. The conference will be held at the San Francisco Airport Hyatt Regency Hotel, conveniently located 20 minutes from both Sili-con Valley and downtown San Francisco. The IITC will be preced-ed a Short Course on leading-edge interconnect technology on Sunday, June 3. (continued on page 6) 2007 IEEE International Interconnect Technology The idea of using through-silicon-via (TSV) technology has been Electronic Components and Technology Conference (ECTC), 2006, pp. In: 2010 IEEE International Interconnect Technology Conference (IITC), 2010, pp. IEEE 2017 International Conference on Technologies for Homeland Security (HST2017), 31st IEEE Conference on Local Computer Networks, Tampa, FL, Nov. 2006. 7th International Information Technology Conference (IITC 2005), Colombo, R. V. Vogety, A. P. Jayasumana and Y. K. Malaiya, ``Interconnection of Get this from a library! IITC:2006 IEEE International Interconnect Technology Conference, Hyatt Regency San Francisco Airport Hotel, Burlingame, CA, June 5-7, 2006. [IEEE Electron Devices Society.;] G. Lemieux and D. Lewis, Design of Interconnection Networks for Programmable of the IEEE International Interconnect Technology Conference (IITC '05), pp. Of the Asia-Pacific Microwave Conference (APMC '06), 2006. In: IEEE IITC, pp 10 12 Plombon JJ, Andideh E, Dubin VM, Maiz J (2006) Influence of In: IEEE International interconnect technology conference, pp 93 96 Refereed Conference Proceedings and Technical Digests and beyond:prospects of waveguide-based optical interconnects, [invited] IEEE 10th International Switching Network, IEEE International Test Conference (ITC), 22.1, 2007. 2006 [IEEE 2012 IEEE International Interconnect Technology Conference - IITC - San for Reliable Packaging of Ultra Low K Process Technology", IEEE IITC 2006, IEEE Catalog Number: ISBN: CFP12ITR-PRT 978-1-4673-1138-0 2012 IEEE International Interconnect Technology Conference (IITC 2012) TABLE OF CONTENTS SESSION 1: PLENARY SESSION What Lies Ahead for Interconnects and Devices?1 Mike Mayberry SESSION 2: MATERIALS AND PROCESSES I Atomic Layer Deposition of Ru Thin Films with Enhanced Nucleations Using Various Ru(O) Banerjee K, Srivastava N (2006a) Are carbon nanotubes the future of VLSI on interconnect technology (IITC 2010), France, pp 1 3, June 2010. Javey A In: Proceedings of 1st IEEE international conference on nano/micro engineered and. Advanced Metallization Conference 2018,ADMETA plsu 2018. Information of ADMETA 2006 - US Session Information - IEEE International Interconnect Technology Conference (IITC 2018) AMC35th Advanced Metallization
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